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Your search returned 9 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1996 Volume number : 19 Issue: 02 |
Millimeter-Wave Monolithic Integrated Circuit Interconnects Using Electromagnetic Field Coupling
(Article)
Subject:
Millimeter Wave
,
Using Jce
,
Electromagnetic Field Measurement
Author:
Georg
Strauss
Wolfgang S.
Menzel
page:
278
-
282
Efficient Reduced-Order Modeling Of Frequency-Dependent Coupling Inductances Associated With 3-D Interconnect Structures
(Article)
Subject:
Interconnect
,
Krylov'S Subspace Method
,
Computational Electromagnetics
Author:
Luis Miguel
Silveira
Mattan
Kamon
Jacob
White
page:
283
-
288
Improved Yield And Performance Of Ball-Grid Array Packages: Design And Processing Guidelines For Uniform And Nonuniform Arrays
(Article)
Subject:
Performance
,
Nonuniformity
,
Guidelines
Author:
Stephen M.
Heinrich
Shilak
Shilak
P. S
Lee
page:
310
-
319
Effect Of Pcb Finish On The Reliability And Wettability Of Ball Grid Array Packages
(Article)
Subject:
Finish At Atme-I
,
Array
,
Package Modeling
Author:
Edwin
Bradley
Kingshuk
Banerji
page:
320
-
330
Accurate Simultaneous Switching Noise Estimation Including Velocity-Saturation Effects
(Article)
Subject:
Simultaneous Update
,
Velocity Spectra
,
Estimation Theory
Author:
S.R
Vemuru
page:
344
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349
Guidelines For High-Performance Electronic Package Interconnections Approach For Strong Coupling
(Article)
Subject:
Guidelines For Developing
,
Electronic Privacy
,
Strong Dimer
Author:
Yang
Yang
J. R
Brews
page:
372
-
381
Flat Spiral Delay Line Design With Minimum Crosstalk Penalty
(Article)
Subject:
Delay Line
,
Signal Integrity
,
Crosstalk
Author:
Ruey-Beei
Wu
Fang-Lin
Chao
page:
397
-
402
A Chips-First Multichip Module Implementation Of Passive And Active Test Coupons Utilizing Texas Instruments' High Density Interconnect Technology
(Article)
Subject:
Chip On Pcb
,
Multichip Module
,
Interconnect
Author:
Timothy M.
Schaefer
Jeffrey J.
Kacines
Barry K.
Gilbert
page:
403
-
416
Thermal Performance Comparison Of High Pin Count Cavity-Up Enhanced Plastic Ball Grid Array (Epbga) Packages
(Article)
Subject:
Thermal
,
Comparison
,
Plastic Ball Grid Array
Author:
Atila
Mertol
page:
427
-
443
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